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Design and Analysis Software Product List

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★Novelty Gift★ INTERMOLD 2016

★Novelty Gift★ INTERMOLD 2016

The password is! At the Autodesk booth, in the CAE Solutions corner, say "I saw the Ipros site."

INTERMOLD2016 27th Mold Processing Technology Exhibition ========================================= ■ Date: April 20 (Wednesday) - 23 (Saturday), 2016 ■ Venue: Intex Osaka ■ Booth Number: 6B-601 (within Autodesk booth) ■ Exhibited Products Resin Flow Analysis Software / Autodesk Moldflow Fluid Analysis Software / Autodesk CFD Structural Analysis Software / Autodesk Simulation Mechanical, Autodesk NASTRAN

  • Structural Analysis
  • Thermo-fluid analysis
  • Other analyses

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Research tools for high-stress GaN devices

Research tools for high-stress GaN devices

Research tools for high-stress GaN devices

This explains the theoretical model of GaN multi-quantum wells (MQW) under high stress. It is possible to obtain the following results for GaN device LEDs grown on silicon in arbitrary crystal orientations using the CrossLight device simulator. The tensile stress from the silicon substrate reduces the band gap of the multi-quantum wells (MQW) and results in a longer wavelength. There is a decrease in piezoelectric charges within the multi-quantum wells (MQW). The reduction in internal quantum efficiency (IQE) is caused by the increase in piezoelectric charges at the electron blocking layer (EBL) interface.

  • simulator

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